Up to -70% for 4 layers FR4 1.0mm
Due to the significant increase in demand, now available at low cost in our pooling production: 4 layer multilayer with 1.0mm thickness, FR4 Tg150, surface ENIG (chemical gold).
Benefit from -42% weight and space savings for compact assemblies in ever smaller and lighter devices. This also reduces FR4 resource usage by -42%.
The low-cost pooling FR4 1.0mm fabrication is available for 2 and 4 layers. In addition, FR4 thicknesses from 0.3 to 7mm can be manufactured.
Multi-CB's comprehensive pooling offer is unparalleled in Europe. Here you can find: an overview of all pooling options.
4 layer 1.0mm pool production - always inclusive:
- Material FR4 1.0mm Tg150, 35µm Cu
- ENIG surface
- Conductor width / spacing, annular ring: 0.1mm
- Drill holes: 0.2mm, unlimited drilling
- Standard production time from 7 working days
- Milling, PTH slits
- E-Test, Design-Rule-Check
- Solder-stop green, 2x
- Legend print white, 1x
- Set-up costs, photo-plot
- Defined layer buildup 4L-02 (optional)
Free& Optional: Defined layer buildup (type 4L-02)
including impedance examples
Estimated final thickness (+/- 10%): 1.0mm
4 layers 1.0mm: Type 4L-02 - impedance examples
Loss Tangent / Dissipation factor (Df): ca. 0.02
Dielectric constant Ԑr for 1x Prepreg 2116: 4.20