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1644 results:
1601. Parameters  
 
1602. Table  
Scored Milled with bridges Milled with bridges & mousebites - Bridges are placed by Multi-CB Bridges and mousebites are placed by Multi-CB  
1603. Parameters  
Covering Min. Drill-Ø Max. Drill-Ø Via Filling 250µm 500µm  
1604. Parameters  
Covering Min. Drill-Ø >> Pad-Ø   Max. Drill-Ø >> Pad-Ø Aspect Ratio* Filled & Capped IPC 4761 Typ VII 150µm 350µm   400µm  
1605. Outer* and Inner layers  
Final thickness* Min. conductor width Min. conductor spacing 105µm 250µm 250µm 140µm 350µm 350µm 210µm 500µm 500µm 400µm** 900µm  
1606. Inner layers  
Copper foil thickness Min. conductor width Min. conductor spacing 105µm 250µm 250µm 140µm 300µm 300µm 210µm 500µm 500µm 400µm**  
1607. Designs  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Leiterplatten starr|1-10 Lagen|1-48 Lagen| Flexible Leiterplatten|1-2 Lagen|1-10 Lagen|DK möglich Starrflex-Leiterplatten|  
1608. 8 Layers  
 
1609. Layer buildup  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Variabler Lagenaufbau|+|+|  Definierter Lagenaufbau|+|+|Def. Lagenaufbau Kundenspezifischer Lagenaufbau|-|+|Preisanfrage i  
1610. Production times  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Standard ab|4AT|8AT|  Express ab|1AT|1AT|   
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