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Printed circuit boards from Multi Circuit BoardsPrinted circuit boards from Multi Circuit Boards
1 - 48 Layers
1WD Express
30 Years experience
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1592 results:
1551. Parameters  
Covering Min. Drill-Ø Max. Drill-Ø Via Filling 250µm 500µm  
1552. Parameters  
Covering Min. Drill-Ø >> Pad-Ø   Max. Drill-Ø >> Pad-Ø Aspect Ratio* Filled & Capped IPC 4761 Typ VII 150µm 350µm   400µm  
1553. Outer* and Inner layers  
Final thickness* Min. conductor width Min. conductor spacing 105µm 250µm 250µm 140µm 350µm 350µm 210µm 500µm 500µm 400µm** 900µm  
1554. Inner layers  
Copper foil thickness Min. conductor width Min. conductor spacing 105µm 250µm 250µm 140µm 300µm 300µm 210µm 500µm 500µm 400µm**  
1555. Designs  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Leiterplatten starr|1-10 Lagen|1-48 Lagen| Flexible Leiterplatten|1-2 Lagen|1-10 Lagen|DK möglich Starrflex-Leiterplatten|  
1556. 8 Layers  
 
1557. Layer buildup  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Variabler Lagenaufbau|+|+|  Definierter Lagenaufbau|+|+|Def. Lagenaufbau Kundenspezifischer Lagenaufbau|-|+|Preisanfrage i  
1558. Production times  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Standard ab|4AT|8AT|  Express ab|1AT|1AT|   
1559. Options  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise Leiterbahn-breite/-abstand min.|100µm/100µm|75µm/105µm 90µm/90µm|  Via min. Ø|200µm|75µm|Aspekt Ratio 1:12 Via Pad min.  
1560. Surfaces  
[Translate to English:] |Leiterplatten-Kalkulator|Sonderfertigung|Hinweise HAL bleifrei|+|+|  HAL bleizinn|+|+|  Kupfer blank|+|+|  Chemisch Zinn|+|+|  Chemisch Silber|-|+|  Chemisch Gold (ENIG)  
Search results 1551 until 1560 of 1592