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1551. Glossar: Component Hole  
Component Hole Component Holes are drills for wired components used with Through-Hole Technology. In doublesided or multilayer boards the holes will be plated through.   
1552. Glossar: Overproduction  
Overproduction Description:The production of printed circuit boards involves chemical processes that have a low risk of failure. We increase quantity for series production to yield ordered quantity…  
1553. Glossar: Hard Gold  
Hard Gold Electroplated hard gold is an abrasion-proof surface used for gold fingers. We galvanically build nickel on the copper track. Then gold is plated over nickel.  
1554. Glossar: Hydraulic press  
Hydraulic press Machine for laminating multilayer boards. During this process pressure and temperature must be precisely controlled.  
1555. Glossar: Sequential Build Up  
Sequential Build Up Description:Production of a multilayer printed circuit board in several lamination sequences. Especially multiple burried vias in high density boards (HDI) require the SBU…  
1556. Glossar: CTI  
CTI CTI stands for Comparative Tracking Index. The CTI defines the leakage current resistance of printed circuit board base material.  
1557. Glossar: FED  
FED The Fachverband Elektronik-Design (FED) is a trade association of electronics manufacturing industry. Their members are from Germany, Austria and Switzerland. FED translates IPC standards and…  
1558. Glossar: Underwriters Laboratories  
Underwriters Laboratories Description:Underwriters Laboratories (UL) is a saftey consulting and certification company. They develop product standards and perform product safety tests. The UL…  
1559. Glossar: Pad  
Pad Description:See land.  
1560. Glossar: Pitch  
Pitch In printed circuit boards pitch is the center-to-center distance of drill holes, BGA pads or component connectors. If grids are smaller than 0.7mm or copper structures smaller than 150µm the…  
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