Bond gold
The PCB surface bond gold is a collective term for bonding-capable surfaces, usually a gold surface. For bonding are applied: immersion gold (ENIG, reductively) for bonding aluminum wire…
Lamination
Multilayer circuits boards comprise cores, prepreg and copper foil. The layers are permanently bonded together during Lamination. Pressure and heat activate the resin on the impregnated…
Marking print
Marking print (alt. legend print or position print) is used to identify the type and position of components on the printed circuit board and for the transfer of information to the…
CEM 1
CEM 1 is a base material for printed circuit boards made of laminated paper. CEM 1 has a core of paper, impregnated with epoxy and one outer layer of glass fabric. Due to the paper core, it is…
Thick copper PCB
A thick copper PCB is usually a printed circuit board with a copper thickness > 105µm. These boards are used for high switching currents in the automotive and industrial…
Surface-Mounting Technology
Description:SMD components are directly connected to solder pads in circuit path. Compared to THT Surface-Mounting Technology doesn't require drill holes and the possible…
THT - Through-Hole Technology
Description:The conventinal mounting scheme for wired components is called Through-Hole Technology. The wire leads are inserted into component holes in a printed…
FR4 Material
FR4 is a class of printed circuit board base material made from a flame retardant epoxy resin and glass fabric composite. FR stands for flame retardant and meets the requirements of…
Via
Description:Vias are plated through holes in a printed circuit board. They connect multiple copper layers, but they are too small for THT components.
On multilayer boards with high-density…
