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1779 results:
1481. Glossar: SMD Stencil  
SMD Stencil SMD stencils are used for the assembly of printed circuit boards (see PCB assembly). They usually consist of stainless steel in the typical thickness of 80µm to 250µm. Openings (pads)…  
1482. Glossar: Location Hole  
Location Hole Description:Location holes are non-plated-through holes (Npth), which allow an accurate positioning of the printed circuit board for processing. The placement of the location holes is…  
1483. Glossar: Via Filling  
Via Filling Via filling is the process of filling the vias with a non-conductive paste in order to close them. Usually this is required for PCBs with a large amount of drills when the fixation in…  
1484. Glossar: Gerber data  
Gerber data The Gerber data type consists of graphics commands, which specify a circuit layout by x- and y- coordinates and vectors. Originally developed for the control of photoplotters, it is now…  
1485. Glossar: HAL  
HAL HAL stands for Hot Air (Solder) Leveling (German: Heißluftverzinnung). Within printed circuit board manufacturing, HAL is the name of the procedure as well as the resulting surface.During the…  
1486. Glossar: HASL  
HASL HASL stands for Hot Air Solder Leveling, definition see HAL.  
1487. Glossar: Gerber  
Gerber Data format used in the printed circuit board manufaction, definition see Gerber data.  
1488. Glossar: RS-274-X  
RS-274-X Description:RS-274-X, stands for the Extended Gerber Format.  
1489. Glossar: RS-274-D  
RS-274-D Description:RS-274-D, stands for the Standard Gerber Format.  
1490. Glossar: Impedance Control  
Impedance Control For printed circuit boards with high frequency signals, the signal integrity has to be provided by good impedance characteristics of the conductors. To ensure the desired…  
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