WEEE Directive
Description:The WEEE Directive (Waste of Electrical and Electronic Equipment) is the EU directive 2012/19/EU to reduce the increasing amount of electronic waste. The aim is reducing or
X-Ray
Description:In printed circuit board technology, X-Ray is used for the analysis of BGA components and in the manufacture of multilayer boards.For the grouting of multilayer boards, X-Ray is use
Yield
Description:In printed circuit board manufacturing, the yield rate (usually given in%) stands for the usable PCBs which can be obtained from a production panel.An optimization of the data, usin
Wave soldering
Wave soldering is a method for soldering components onto printed circuit boards. The preheated circuit board is driven over a pump generated wave of liquid solder, which wets the compo
Double-sided printed circuit board
Description:A double-sided printed circuit board consists of carrier material (nowadays usually FR4) with copper-clad on top and bottom. The conductor tracks are et
ENIG
The PCB surface ENIG (Electroless Nickel Immersion Gold) is in common parlance referred to as ‘Chemical gold’ or ‘Immersion Gold’. The ENIG surface is composed of a chemically deposited nickel l
Eurocard
The very frequently used Eurocard format describes a standardized size of printed circuit boards with dimensions of 100mm x 160mm and the thickness 1.6mm. Also common are boards in Double Eu
Automated Optical Inspection
The Automated Optical Inspection (AOI) is a common test method for inner layers on multilayer boards. The inspection takes place before lamination. Cameras capture the tr
