Component Hole
Description:Component Holes are drills for wired components used with Through-Hole Technology. In doublesided or multilayer boards the holes will be plated through.
Overproduction
Description:The production of printed circuit boards involves chemical processes that have a low risk of failure. We increase quantity for series production to yield ordered quantity a
Hard Gold
Description:Electroplated hard gold is an abrasion-proof surface used for gold fingers. We galvanically build nickel on the copper track. Then gold is plated over nickel.
HDI
Description:High density circuits demand high accuracy from production. If you use SMD components and fine line (track <125µm, drill <=0,2mm), we speak of HDI PCBs. HDI stands for High Dens
Sequential Build Up
Description:Production of a multilayer printed circuit board in several lamination sequences. Especially multiple burried vias in high density boards (HDI) require the SBU technol
Leakage current resistance
By moisture or impurities between two points on the, in principle insulating, PCB base material, a measurable current flow is measurable if a correspondingly high voltage i
IPC
Description:IPC is an international trade association that represents all branches of electronics manufacturing industry. The mission statement reads Association Connecting Electronics Industries
FED
Description:The Fachverband Elektronik-Design (FED) is a trade association of electronics manufacturing industry. Their members are from Germany, Austria and Switzerland. FED translates IPC stand
