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1592 results:
1461. Glossar: BGA  
BGA BGA stands for Ball Grid Array. See BGA Design-Aid  
1462. Glossar: Photoresist  
Photoresist Description:Photoresists are usually polymers for photochemical machining. Prior to etching the resist is applied to copper. Then layout is exposed on prepared boards. Common resists resp  
1463. Glossar: RoHS  
RoHS Description:RoHS is the Restriction of Hazardous Substances Directive. This EU legislation says that electronic devices may not contain lead or certain other hazardous substances. For circuit bo  
1464. Glossar: Aspect Ratio  
Aspect Ratio Aspect Ratio is the quotient of the PCB thickness to the diameter of the final hole. Maximum aspect ratio is limited by drilling machine and throughplating process for vias.  
1465. Glossar: PLC  
PLC Description:PLC stands for Performance Level Categories, an indicator for printed circuit`s leakage current resistance.  
1466. Glossar: Design for Assembly  
Design for Assembly As well as DFM describes the process to make printed circuit boards ‘producible’, Design for Assembly DfA stands for designing printed circuit boards which are already optimized f  
1467. Glossar: DfA  
DfA In PCB design, DfA stands for Design for Assembly.  
1468. Glossar: Design for Manufacturing  
Design for Manufacturing Design for Manufacturing (short DfM) describes the process of PCB layouting in close coordination with the PCB production and within the printed circuit board manufacturer pr  
1469. Glossar: DfM  
DfM In PCB design, DfA stands for Design for Manufacture.  
1470. Glossar: 2-layer board  
2-layer board 2-layer board, see Double-sided printed circuit board  
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