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1581 results:
1441. Glossar: HDI  
HDI Description:High density circuits demand high accuracy from production. If you use SMD components and fine line (track <125µm, drill <=0,2mm), we speak of HDI PCBs. HDI stands for High Dens  
1442. Glossar: Hydraulic press  
Hydraulic press Description:Machine for laminating multilayer boards. During this process pressure and temperature must be precisely controlled.  
1443. Glossar: Sequential Build Up  
Sequential Build Up Description:Production of a multilayer printed circuit board in several lamination sequences. Especially multiple burried vias in high density boards (HDI) require the SBU technol  
1444. Glossar: Leakage current resistance  
Leakage current resistance By moisture or impurities between two points on the, in principle insulating, PCB base material, a measurable current flow is measurable if a correspondingly high voltage i  
1445. Glossar: CTI  
CTI CTI stands for Comparative Tracking Index. The CTI defines the leakage current resistance of printed circuit board base material.  
1446. Glossar: IPC  
IPC Description:IPC is an international trade association that represents all branches of electronics manufacturing industry. The mission statement reads Association Connecting Electronics Industries  
1447. Glossar: FED  
FED Description:The Fachverband Elektronik-Design (FED) is a trade association of electronics manufacturing industry. Their members are from Germany, Austria and Switzerland. FED translates IPC stand  
1448. Glossar: Underwriters Laboratories  
Underwriters Laboratories Description:Underwriters Laboratories (UL) is a saftey consulting and certification company. They develop product standards and perform product safety tests. The UL marking  
1449. Glossar: Pad  
Pad Description:See land.  
1450. Glossar: Pitch  
Pitch In printed circuit boards pitch is the center-to-center distance of drill holes, BGA pads or component connectors. If grids are smaller than 0.7mm or copper structures smaller than 150µm the bo  
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