Quality assurance is carried out in several stages. The press-in force is often monitored non-destructively during the process (force-displacement monitoring). Destructive push-out tests can…
Two international standards in particular set the standard for press-fit technology:
IEC 60352-5: This is the most important standard for solderless electrical connections - Part 5: Press-fit…
Yes, this is possible and is used in the automotive industry, for example, to attach connectors directly to the rigid section of a rigid-flex PCB. Particular care must be taken in the transition area…
A gas-tight connection is created by cold welding the contact materials at the microscopically small contact points between the pin and the hole wall. During press-fitting, the surfaces are pressed…
Press-fit technology is favoured wherever maximum reliability is required and thermal loads must be avoided. Typical areas of application are
Automotive & commercial vehicle electronics:…
As a rule, no. Once the material bond has been destroyed, the adhesion cannot be restored. The affected circuit board must be regarded as scrap and replaced.
It is often visible to the naked eye: white spots or blistering between the layers, especially after soldering. In severe cases, the circuit board bulges visibly (blistering). A gap between the…
Standard FR4 is susceptible if it has been exposed to moisture and extreme temperature peaks. High-Tg materials (higher glass transition temperature) or polyimide are significantly more resistant to…
Both terms are often used synonymously, but describe different degrees of severity. Delamination refers to the separation of the layers on the inside. Blistering is the visible manifestation of this…
The most important step is pre-baking the PCBs before soldering to remove any trapped moisture. In addition, the specified temperature profile of the circuit board should be adhered to exactly in…
