HDI
High-density circuits place special demands on production. Even the use of SMD components and fine structures with conductor track widths <125µm and via diameters<=0.2mm significantly…
IPC
The IPC, Association Connecting Electronics Industries, is an international trade association for the circuit industry. This includes CAD designers, PCB manufacturers, component manufacturers,…
Tracking resistance
The tracking resistance of PCB base material is specified as a CTI value (Comparative Tracking Index) and refers to the highest voltage (volts) that does not cause a failure due…
Layer
Layer stands for one level of the printed circuit board. When talking about the material, the number of layers usually refers to the copper layers. Within a PCB layout programme, however, in…
Bonding
Bonding is the generic term for processes in semiconductor and assembly technology in which electronic components (e.g. an integrated circuit / IC) are mechanically attached and electrically…
Chip on Board / COB
Chip-on-board (COB) is an assembly technique in electronics production in which a bare semiconductor chip (die) is mounted and contacted directly on a printed circuit board…
Delamination
Delamination is one of the most critical material defects in PCB technology. It describes the unwanted bursting or detachment of the copper layers from the base material (usually FR4)…
Gold wire bonding
Gold wire bonding is an established process in semiconductor technology for creating electrical connections between the microchip and the connections of the housing (e.g. lead…
Aluminium wire bonding
Aluminiumwire bonding is an established contacting process in semiconductor and power electronics in which aluminium wires are used for the electrical connection between chip…
