Index Type Value min.
A Plated-through via Ø 200µm
B Backdrill Ø 400µm
C Copper clearance 150µm
D Ø-Difference circumf. 100µm
E Backdrill depth 200µm
F T
For simulating stubs, as well as high-speed digital design layouts, the software ADS by Keysight Technologies can be used. ADS is capable of linear, non-linear and electromagnetic (2.5D and 3D) simu
Pitch
The minimum pitch for Via-in-Pad solutions is 600µm (standard technology). This results of:
200µm min. drill diameter 400µm min. pad size 50µm min. solder-stop clearance 100µm min. sol
The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips. With a reliable Via Filling / Capping
Via-in-Pad Parameters
Standard Special production Special production
Filling IPC 4761 Type VII IPC 4761 Type VII none
Min. Drill-Ø 200µm 150µm 100µm
Min. Pad-Ø 400µm 350µm 300µm
Max. Drill-Ø 500µ
The use of Via-in-Pad technology is increasingly influenced through the necessity of high-density BGAs (ball grid arrays) and the miniaturization of SMD chips. With a reliable Via Filling / Capping
Plated half-holes (or castellated holes) are predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. E.g. the combination
Advice
The milling tolerance is +/- 150µm Distance pad to pad: min. 250µm Milling gap within a panel: min. 10mm (see drawing) Most common surface: chemical gold (ENIG) Use the largest hole diameter p
Manufacturing
Through setting back the copper shell from the conture, the plating is protected from mechanical damaging. Therefore the plated half-holes can be milled precisely what strongly
