As a standard, you get a variable layer buildup, which is defined by following parameters. The typical values in brackets:
Material type (FR4) Final thickness (1,55mm) Cu outer layers - final (35µ
You can choose between three options for your multilayer buildup:
Variable layer buildup (Standard) - Changing stackup according to availability [free of charge] Defined layer buildup -&nb
At Multi-CB, you can obtain various types of PCBs of the highest quality at the usual favourable prices. In addition to the industry standard ‘FR4 printed circuit boards’ according to IPC-A-600 clas
Effect of the copper thickness on the line resistance
In the favourable pool service for 4 layers, either 18µm or 35µm copper is possible on the inner layers. The influence on the line resistance and
Thick-Copper technology offers the possibility to implement complex switches in limited space in combination with circuitry for high current levels. Multi-CB has reliable processes to produce copper
Typical application areas
High current applications such as power supply, power distributor, converter, motor control, DC link, ... Thermal distribution for good thermal management Heat dissipation o
A prepreg (from pre-impregnated) is fibreglass impregnated with resin. The resin is pre-dried, but not hardened, so that when it is heated, it flows, sticks, and is completely immersed. Prepregs are
