The standard layer buildups for metal core circuit boards are as follows. Please also observe the technical options for metal core circuit boards.
Additional information:
Design-Rules for layer…
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or…
Printed circuit boards are connected directly to a motherboard (mainboard) using PC / PCI slot connectors. There exist the PC-AT Standard (also called “ISA”) with a pitch of 2.54mm (0.1 inch) and…
For 2 or more flex layers, please ensure a shifted placement of the conductor traces on the front and back sides of the flexible portion.
Use curves instead of corners in the conductor trace…
SMD-Stencils are precision tools which have to comply with high requirements, as they take a key role in the SMT (surface mount technology) process. We offer following SMD-Stencils: Solder paste…
For multilayer circuit boards, the development leads to smaller vias and an increasing number of layers. The tighter manufacturing tolerances demand a reliable registration process of conductive…
