Here you can download the Basic Design Rules incl. Design Parameters.
The following parameters are exemplary for 35μm copper thickness. For other thicknesses / special production,…
In this section of the Design-Aid, we provide all information regarding the PCB surface.
Conductor / Copper thickness informs about the perfect ratio of chosen copper thickness to…
The minimum permissible values for conductor trace width/spacing and annual ring, depending on the copper thickness, can be found in the following table.
Outer* and Inner layers
Effect of the…
In the following the factors influencing the current carrying capacity of circuit boards are named in context with heat development on the conductors, to provide practical guidance for…
to pads to solder-stop clearance
Legend print spacing min. 150µm 100µm
Font height Optimum font width
1.2mm 150µm (6mil)
1.5mm 180µm (7mil)
1.8mm 200µm (8mil)
A legend print / marking…
Several technical or production-related demands require the covering / sealing of vias. A basic distinction is made between the following methods:
Via Tenting (covering) or overprinting the…
Buried Via
Buried vias are used to create connections of the inner layers, which have no contact with the outer layers. The holes for each connection level must be defined as a separate drill file.…
see also Component holes
An annular ring is the circumferential copper ring around a plated contact.
Attention:
You should design the annular rings as large as possible (annular ring ≥…
Design Parameters
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout.
Minimum…
Plated half-holes (or castellated holes) are predominantly used for board-on-board connections, mostly where two printed circuit boards with different technologies are combined. E.g. the combination…
