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101. Data sheets  
The following data sheets for materials used by Multi-CB, as well as general information, are available for downloading. Please note that the materials listed may be replaced by technically equivalen  
102. Printed circuit board materials - Material for high-Tg circuit boards (selection)  
Material for high-Tg circuit boards (selection) Material for High-Tg boards;Tg;CTE-z (T  
103. Rigid-Flex PCBs - UL certification for Rigid-Flex circuit boards  
UL certification for Rigid-Flex circuit boards At Multi-CB, you also get Rigid-Flex circuit boards with UL certification. Multi-CB’s UL identification number for flex and Rigid-Flex circuit boards  
104. Rigid-Flex PCBs  
Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another. The proper application of Rigid-Flex circuit bo  
105. Printed circuit board materials - 2 layers (plated-through)  
2 layers (plated-through) Material for metal core boards 2 Layers (plated-through) Thermal conductivity Thermal resistance Surface Resistivity Dielectric glass transition (Tg) Dielectric Breakdown  
106. Printed circuit board materials - 1 layer  
1 layer Material for metal core boards 1 Layer Thermal conductivity Thermal resistance Surface Resistivity Dielectric glass transition (Tg) Dielectric Breakdown (AC)* Tracking resistance CTI &nbs  
107. Printed circuit board materials - Materials for metal core boards  
Materials for metal core boards  
108. Printed circuit board materials  
Various requirements for printed circuit boards make the use of different circuit board substrates necessary.  Whereas for many standard applications the classical FR4 material is sufficient,  
109. Thermal management - Basic considerations for thermal management  
Basic considerations for thermal management As a carrier of the components, the printed circuit board is the main component for achieving coherent thermal management. Inadequate optimization must be  
110. Thermal management - Thermal Via Array  
Thermal Via Array Thin, double-sided or multilayer printed circuit boards with a array of thermal vias (Via-in-Pad), which improve the heat conduction. The thickness of the circuit board is typically  
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