With sideplating of printed circuit boards, the PCB edge is used for technical features of the later assembly. Portions of the printed circuit`s contour but also partial areas within the circuit boar
Design Parameters
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout.
Minimum overla
Design Parameters
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout.
Minimum overla
see also Component holes
An annular ring is the circumferential copper ring around a plated contact.
Attention:
You should design the annular rings as large as possible (annular ring ≥ 125µ
PTH Component holes
For manufacturing reasons, PTH component holes are drilled larger than the final diameter defined by you. The final diameter is only achieved after plating.
You should design th
A unique differentiation in your data between plated-through holes (PTH) and non plated- through holes (npth) is of fundamental importance!
This means that you must, additional to your Gerber data,
Attention:
You should design the annular rings as large as possible (annular ring ≥ 125µm). Please specify component holes ≤ 0.5mm with your order! Component holes ≤ 0.6mm must be manufactur
Buried Via
Buried vias are used to create connections of the inner layers, which have no contact with the outer layers. The holes for each connection level must be defined as a separate drill file
;Aspect Ratio;Ø min.;Ø max.;Via Pad;Annular ring min.*
Blind Via - mechanical;1:1;200µm;300µm;400µm;100µm
⇒ as Special production;1:1.2;150µm;150µm;350µm;100µm
Blind Via - laser;1:1;100µm;100µm;28
