BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matri
BGAs (Ball Grid Arrays) are SMD components with connections on the bottom of the component. Each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matri
Correct layer orientation
In your layout program, the label should appear in the copper as shown in the diagram. As seen from above, the word “TOP” should be legible, the label “BOT” for the bottom l
Problems with layer orientation
Even when your data uniquely defines which layer the top or bottom layer is, the layer orientation cannot be determined without an inscription in the copper, since nea
Layer definitions for multilayer
For multilayers, we recommend a continuous label for the layers, as shown in the diagram. Once again, here it is important that the label for the bottom layer appears
For correct production of your printed circuit board, it must have a label in the copper of the top and bottom layer, for multilayer additionally on the inner layers.
We therefore recommend a unif
The Multi-CB printed circuit board calculator allows you to calculate the price of your Circuit Boards and SMD-Stencils quickly and easily!
We offer 1-48 layers from 48h express, SMD-Stencils, Flex
Your advantages at a glance
High-tech parameters always included One of the broadest pooling offers Europe Fast production & customised solutions Reliable delivery to over 50 countries Personal s
