Modification of the pad form
Generally, you should (along with your assembly) make a decision in respect of angular or rounded pads. If you have relatively large pad areas in your design, adding…
Processing of the stencil pads
Generally we recommend a reduction of the stencil pads (apertures) by 10%. This could be the done by the customer (with export of the paste data) or is done by us on…
Additional information:
Design-Rules for layer buildups Technical options for Metal Core boards Available prepregs, cores, and foils Series, Prototypes, Flex, Rigid-Flex, Metal Core standard layer…
Additional information:
Design-Rules for layer buildups Available prepregs, cores, and foils Standard layer buildup Flex, Rigid-Flex, Metal Core sample layer buildups Prototypes, Series available…
Additional information:
Design-Rules for layer buildups Available prepregs, cores, and foils Standard layer buildup Flex, Rigid-Flex, Metal Core sample layer buildups Prototypes, Series available…
The tin surface in the HAL process is very thin right at the edges, and may lead to oxidation or solder problems. A good solderability can be guaranteed only in the middle of the "drop".
