Metal core - IMS
Metal core (also called IMS - Insulated Metal Substrate) PCBs are used to dissipate heat quickly and effectively from components. At Multi-CB you get IMS circuit boards…
Basic considerations for thermal management
As a carrier of the components, the printed circuit board is the main component for achieving coherent thermal management. Inadequate optimization must be…
Manufacturing date
Depending on the type of application, it may be necessary to apply the manufacture dates in addition to the UL identification. This is usually inclusive.
Additional information
RoHS (Restriction of the use of certain Hazardous Substances) REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) DecaBDE (Flame retardant…
In addition to dependability and friendly service, the quality of our products is of primary concern to us. This begins as soon as your data arrives, with our comprehensive Design Rule Check.
We…
Dynamic bending: spontaneous and frequent bending Optimization for dynamic bending:
drill holes or slots copper edges at the bending location copper stiffeners as bending aids
Stable bending: single occurrence bending, e.g. "bend-to-install" Optimization for stable bends:
drill holes or slots Contour narrowing Stabilization through more copper
The custom layer buildup is special production.
Make your choice from the of common cores and prepregs. Please clarify the material availability with our technical department.
The custom layer buildup does not contain impedance control. If you need impedance control, please select it in the online calculator and provide us with your impedance requirements.
