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1779 results:
841. Solder-stop - Solder-stop type  
Solder-stop type Depending on the production line and utilization, we are usinge various brands and processes for the solder-stop. These brands behave technically absolutely equivalent but can…  
842. Layer buildup  
Multilayer circuit boards comprise outer and inner layers (copper layers) and help to achieve more complex, denser wiring structures. Multilayer circuit boards are pressed from the following…  
843. Layer buildup  
Mixed Dielectric Multilayers (combination of different materials) are possible, please contact us.  
844. Layer buildup - Rules for layer buildup  
Rules for layer buildup  
845. Layer buildup - SBU-Multilayer  
SBU-Multilayer Multi-CB can also create sequential layer buildups (= SBU), in which multiple pressure sequences are used. This permits use of blind vias and buried vias, allowing even higher…  
846. Layer buildup - Lasered blind vias  
Lasered blind vias Blind vias are lasered for diameters smaller than 150µm. The prepreg and copper foil are then replaced by RCC (Resin Coated Copper) foil, whose resin is similar to the epoxy in…  
847. Layer buildup - Electric strength  
Electric strength To maintain the highest possible capacitance between two large-area potentials, the layer spacing should be as small as possible. The necessary voltage separation between the…  
848. PCB Delivery Costs DHL - Logistics services  
Logistics services Worldwide shipping with UPS and DHL, in more than 50 countries Cheap shipping thanks to high shipping volume Powerful customs software for accurate and complete customs…  
849. SMD-Stencils Design-Aid  
Terms in this Design-Aid: top side = squeegee side, top view bot side = opposite side of squeegee, bottom view aperture = hole in the stencil, stencil pad  
850. SMD-Stencils Design-Aid - Rule of thumb for detection of stencil thickness  
Rule of thumb for detection of stencil thickness  
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