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The variable layer structure is the option most frequently chosen by our customers and is suitable for many applications.

812. Standard layer buildup - Additional information:

Additional information: Design-Rules for layer buildups Hybrid layer buildup Rogers / FR4 Available prepregs, cores, and foils Series-, Prototypes-, Flex-, Rigid-Flex-, Metal Core- sample layer…

813. Prepregs, cores, foils - Additional information:

Additional information: Metal Core PCBs Standard layer buildup Flex-, Rigid-Flex-, Metal Core- sample layer buildups Material data sheets

814. Prepregs, cores, foils - Cores

Cores Circuit boards cores are pre-pressed layers according to the pattern: copper foil – prepreg – copper foil. Multi-CB also manufactures printed circuit boards with metal core. PCB cores that are…

815. Layout examples for impedance - Defined layer buildup 4L-H02 (Rogers 4350B - 254µm core / FR4)

Defined layer buildup 4L-H02 (Rogers 4350B - 254µm core / FR4)

816. Layout examples for impedance - Defined layer buildup 4L-H01 (Rogers 4350B - 168µm core / FR4)

Defined layer buildup 4L-H01 (Rogers 4350B - 168µm core / FR4)

817. Layout examples for impedance - Defined layer buildup 8L-01

Defined layer buildup 8L-01

818. Layout examples for impedance - Defined layer buildup 6L-01

Defined layer buildup 6L-01

819. Layout examples for impedance - Defined layer buildup 4L-02

Defined layer buildup 4L-02

820. Layout examples for impedance - Defined layer buildup 4L-01

Defined layer buildup 4L-01