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FR4 Tg150 at no extra charge for multilayers. High-quality, process-reliable and at the same time standard prepregs: high quality and long-term reliability of the circuit boards. Selectable with…

832. Standard layer buildup

The defined layer buildup does not yet include impedance control! Impedance control comes with an extra charge in the PCB calculator.

833. Standard layer buildup - Defined layer buildup - your advantages with Multi-CB

Defined layer buildup - your advantages with Multi-CB

834. Standard layer buildup

The variable layer structure is the option most frequently chosen by our customers and is suitable for many applications.

835. Standard layer buildup - Additional information:

Additional information: Design-Rules for layer buildups Hybrid layer buildup Rogers / FR4 Available prepregs, cores, and foils Series-, Prototypes-, Flex-, Rigid-Flex-, Metal Core- sample layer…

836. Prepregs, cores, foils - Additional information:

Additional information: Metal Core PCBs Standard layer buildup Flex-, Rigid-Flex-, Metal Core- sample layer buildups Material data sheets

837. Prepregs, cores, foils - Cores

Cores Circuit boards cores are pre-pressed layers according to the pattern: copper foil – prepreg – copper foil. Multi-CB also manufactures printed circuit boards with metal core. PCB cores that are…

838. Layout examples for impedance - Defined layer buildup 4L-H02 (Rogers 4350B - 254µm core / FR4)

Defined layer buildup 4L-H02 (Rogers 4350B - 254µm core / FR4)

839. Layout examples for impedance - Defined layer buildup 4L-H01 (Rogers 4350B - 168µm core / FR4)

Defined layer buildup 4L-H01 (Rogers 4350B - 168µm core / FR4)

840. Layout examples for impedance - Defined layer buildup 8L-01

Defined layer buildup 8L-01