Your advantage through block exemption: Solder-stop bridges < 100μm can peel off, contaminate pads and thus make soldering more difficult. See also Pitch vs. Pad width.
Gang mask opening
If the minimum values for solder-stop clearance (50μm) and solder-stop bridge (100μm) are undercut, the complete solder-stop bridge is omitted (so-called gang mask opening). This…
Solder-stop type
Depending on the production line and utilization, we are usinge various brands and processes for the solder-stop. These brands behave technically absolutely equivalent but can…
Multilayer circuit boards comprise outer and inner layers (copper layers) and help to achieve more complex, denser wiring structures. Multilayer circuit boards are pressed from the following…
SBU-Multilayer
Multi-CB can also create sequential layer buildups (= SBU), in which multiple pressure sequences are used. This permits use of blind vias and buried vias, allowing even higher…
Lasered blind vias
Blind vias are lasered for diameters smaller than 150µm. The prepreg and copper foil are then replaced by RCC (Resin Coated Copper) foil, whose resin is similar to the epoxy in…
Electric strength
To maintain the highest possible capacitance between two large-area potentials, the layer spacing should be as small as possible. The necessary voltage separation between the…
