Additional information
Layout examples for impedances (Defined layer buildup) High frequency PCBs at Multi-CB DRC, E-Test, A.O.I., X-RAY, CCD - OIR quality control Overview of technical options
Positioning of PCB data on the SMD-Stencil
The positioning of the PCB data on the SMD-Stencil follows this standard:
A) Customer sends stencil data with included contour / data positioning:
The…
Stencil pads
Stencils are generally lasered from the bottom-side. The production-related conical cross-section is then wider on the side opposite to the squeegee and allows a better peeling after…
Modification of the pad form
Generally, you should (along with your assembly) make a decision in respect of angular or rounded pads. If you have relatively large pad areas in your design, adding…
Processing of the stencil pads
Generally we recommend a reduction of the stencil pads (apertures) by 10%. This could be the done by the customer (with export of the paste data) or is done by us on…
Additional information:
Design-Rules for layer buildups Technical options for Metal Core boards Available prepregs, cores, and foils Series, Prototypes, Flex, Rigid-Flex, Metal Core standard layer…
Additional information:
Design-Rules for layer buildups Available prepregs, cores, and foils Standard layer buildup Flex, Rigid-Flex, Metal Core sample layer buildups Prototypes, Series available…
