Printed circuit board materials

Various requirements for printed circuit boards make the use of different circuit board substrates necessary.

Whereas for many standard applications the classical FR4 material is sufficient, possibly in high Tg version (for improved thermo-mechanical properties), for other areas (such as high frequencies) alternate materials are absolutely required.

The following information is intended as a abstract summary of all available material types and their fundamental properties, to make it easier for you to make a selection according to the required field of application.

The standard values of the processed FR4 materials can be found in following PDF:
FR4 material - standard values.

Material samples of the company Rogers can directly be requested here:
http://rogerscorp.force.com/samples/samples_public

On request, you can order circuit boards with EN45545-2: 2013 certified Isola material (fire protection requirements for rail vehicles): EN45545-2: 2013 Information.

Please note: The selected materials may be replaced by technically equivalent or similar products, according to available stocks on hand.

Materials for rigid circuit boards

Material for rigid PCBs	Tg	CTE-z	εr	Electric strength	Surface resistivity	CTI	Td260	Td288	Td value	Peel strength
Material for rigid PCBs		Tg	°C	CTE-z	ppm/°C	εr	@1GHz	Electric strength	KV/mm	Surface resistivity	MΩ	CTI	PLC	Td260	min	Td288	min	Td value	°C	Peel strength	N/mm
Material for rigid PCBs	ISOLA Duraver DE104 Standard FR4	Tg	135°	CTE-z	70	εr	4,37	Electric strength	50	Surface resistivity	1,0 x 10^6	CTI	PLC 2	Td260	12	Td288	-	Td value	315°	Peel strength	1,6
Material for rigid PCBs	ISOLA Duraver DE104 KF FR4 tracking resistant	Tg	135°	CTE-z	45	εr	4,6 - 4,9*	Electric strength	45	Surface resistivity	1,0 x 10^6	CTI	PLC 1	Td260	12	Td288	-	Td value	315°	Peel strength	1,6
Material for rigid PCBs	ISOLA DE156 FR4 halogen-free	Tg	155°	CTE-z	45	εr	4,01	Electric strength	36	Surface resistivity	4,0 x 10^6	CTI	-	Td260	60	Td288	>10	Td value	390°	Peel strength	-
Material for rigid PCBs	ISOLA IS410 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	εr	3,90	Electric strength	50	Surface resistivity	8,0 x 10^6	CTI	PLC 3	Td260	50	Td288	10	Td value	350°	Peel strength	1,2
Material for rigid PCBs	ISOLA IS420 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	εr	4,17	Electric strength	40	Surface resistivity	3,0 x 10^6	CTI	PLC 3	Td260	60	Td288	15	Td value	350°	Peel strength	1,3
Material for rigid PCBs	ISOLA P96 Polyimid-based	Tg	260°	CTE-z	55	εr	3,78	Electric strength	44	Surface resistivity	3,0 x 10^6	CTI	PLC 4	Td260	60	Td288	60	Td value	396°	Peel strength	1,3
Material for rigid PCBs	ISOLA G200 BT-Epoxy	Tg	180°	CTE-z	55	εr	3,70	Electric strength	45	Surface resistivity	2,2 x 10^6	CTI	PLC 3	Td260	60	Td288	10	Td value	325°	Peel strength	1,0
Material for rigid PCBs	Shengyi S1141 FR4 Alternative	Tg	140°	CTE-z	65	εr	4,60*	Electric strength	60	Surface resistivity	5,4 x 10^7	CTI	PLC 3	Td260	15	Td288	2	Td value	310°	Peel strength	1,8
Material for rigid PCBs	Shengyi S1000-2 FR4 HTg alternative	Tg	180°	CTE-z	45	εr	4,80*	Electric strength	63	Surface resistivity	7,9 x 10^7	CTI	PLC 3	Td260	60	Td288	20	Td value	345°	Peel strength	1,4
Material for rigid PCBs	ITEQ IT-180A FR4 HTg alternative	Tg	175°	CTE-z	45	εr	4,40	Electric strength	30	Surface resistivity	1 x 10^4	CTI	-	Td260	60	Td288	30	Td value	345°	Peel strength	1,0

* at 1MHz

Unless otherwise noted, the CTI (Comparative Tracking Index) which indicates the tracking resistance, is PLC3 (175V - 250V) for rigid PCBs. On request, we are also able to produce PCBs with PLC 2 (> 250V), PLC 1 (> 400V) or PLC 0 (> 600V). See Overview of CTI / PLC.

Materials for flexible circuit boards

Material for flexible PCBs	Max. recommended operating temperature	Copper type	Glass transition temperature Tg	εr	CTE-z	Electric strenght	Surface resistivity	Peel strength
Material for flexible PCBs		Max. recommended operating temperature	°C	Copper type	*	Glass transition temperature Tg	°C	εr	@1MHz	CTE-z	ppm/°C	Electric strenght	KV/mm	Surface resistivity	MΩ	Peel strength	N/mm
Material for flexible PCBs	Polyimide + Adhesive	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	Shengyi SF305	Max. recommended operating temperature	105°	Copper type	RA	Glass transition temperature Tg	-	εr	3,6	CTE-z	-	Electric strenght	21	Surface resistivity	1 x 10^5	Peel strength	1,1
Material for flexible PCBs	Adhesiveless	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	DuPont Pyralux AP	Max. recommended operating temperature	180°	Copper type	RA	Glass transition temperature Tg	220	εr	3,4	CTE-z	25	Electric strenght	256	Surface resistivity	1 x 10^10	Peel strength	1,8
Material for flexible PCBs	Panasonic RF775	Max. recommended operating temperature	130°	Copper type	ED	Glass transition temperature Tg	343	εr	3,2	CTE-z	-	Electric strenght	276	Surface resistivity	1 x 10^8	Peel strength	1,7
Material for flexible PCBs	Thinflex W-05050	Max. recommended operating temperature	105°	Copper type	ED	Glass transition temperature Tg	350	εr	3,3	CTE-z	24	Electric strenght	216	Surface resistivity	1 x 10^5	Peel strength	0,6
Material for flexible PCBs	PI Coverlay	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	Shengyi SF305C	Max. recommended operating temperature	105°	Copper type	-	Glass transition temperature Tg	-	εr	-	CTE-z	-	Electric strenght	-	Surface resistivity	3 x 10^6	Peel strength	-
Material for flexible PCBs	DuPont Pyralux FR	Max. recommended operating temperature	180°	Copper type	-	Glass transition temperature Tg	-	εr	3,5	CTE-z	-	Electric strenght	138	Surface resistivity	1 x 10^7	Peel strength	-
Material for flexible PCBs	Adhesive tape	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	3M 9077	Max. recommended operating temperature	150°	Copper type	-	Glass transition temperature Tg	-	εr	-	CTE-z	-	Electric strenght	-	Surface resistivity	-	Peel strength	-

* RA = Rolled copper, suitable for dynamic, flexible applications; ED = Electrolytically deposited copper , only suited for stable and semi-dynamic applications

Materials for metal core boards

1 layer

Technical properties	Unit	KL HA50 (type2)	TC-Lam 1.3	KL (type3)	Test method
Technical properties	Data sheet	Unit	-	KL HA50 (type2)	KL HA50	TC-Lam 1.3	TC-Lam 1.3	KL (type3)	KL HA50	Test method	-
Technical properties	Area of application	Unit	-	KL HA50 (type2)	Standard	TC-Lam 1.3	Standard	KL (type3)	Extended	Test method	-
Technical properties	Thermal conductivity factor	Unit	W / m*k	KL HA50 (type2)	1.6	TC-Lam 1.3	1.3	KL (type3)	2.2	Test method	ASTM-D 5470
Technical properties	Dielectric constant εr	Unit	(bei 1 MHz)	KL HA50 (type2)	5.3	TC-Lam 1.3	-	KL (type3)	5.5	Test method	IEC-61189
Technical properties	Surface resistance	Unit	MΩ	KL HA50 (type2)	1.0 * 10^6	TC-Lam 1.3	1.0 * 10^7	KL (type3)	1.0 * 10^6	Test method	IEC-61189
Technical properties	Thermal durability	Unit	K / W	KL HA50 (type2)	-	TC-Lam 1.3	0.77	KL (type3)	-	Test method	ASTM-E 1225
Technical properties	Glass transition dielectric (Tg)	Unit	°C	KL HA50 (type2)	122	TC-Lam 1.3	100	KL (type3)	122	Test method	IPC-TM150
Technical properties	Dielectric breakdown (AC)*	Unit	kV	KL HA50 (type2)	4.0 - 6.0	TC-Lam 1.3	5.0	KL (type3)	4.0 - 6.0	Test method	IPC-TM-650
Technical properties	CTI	Unit	V	KL HA50 (type2)	600	TC-Lam 1.3	600	KL (type3)	600	Test method	UL746A

2 layers (plated-through)

Technical properties	Unit	CCAF-04	CCAF-05	Test method
Technical properties	Data sheet	Unit	-	CCAF-04	CCAF-04	CCAF-05	CCAF-05	Test method	-
Technical properties	Area of application	Unit	-	CCAF-04	Standard	CCAF-05	Extended	Test method	-
Technical properties	Thermal conductivity factor	Unit	W / m*k	CCAF-04	1.5	CCAF-05	2.2	Test method	ASTM-D 5470
Technical properties	Dielectric constant εr	Unit	(bei 1 MHz)	CCAF-04	4.2	CCAF-05	4.24	Test method	IEC-61189
Technical properties	Surface resistance	Unit	MΩ	CCAF-04	5.0 * 10^7	CCAF-05	3.68 * 10^7	Test method	IEC-61189
Technical properties	Thermal durability	Unit	K / W	CCAF-04	0.65	CCAF-05	0.45	Test method	ASTM-E 1225
Technical properties	Glass transition dielectric (Tg)	Unit	°C	CCAF-04	-	CCAF-05	-	Test method	IPC-TM150
Technical properties	Dielectric breakdown (AC)*	Unit	kV	CCAF-04	4.0	CCAF-05	6.0	Test method	IPC-TM-650
Technical properties	CTI	Unit	V	CCAF-04	600	CCAF-05	600	Test method	UL746A

* Depending ondielectric thickness,in this example100µm.

Material for high frequency boards

Material for high frequency boards	Tg	CTE-z	εr	Electric strenght	Surface resistivity	Thermal conductive factor	Td260	Td288	Td value	Peel strength
Material for high frequency boards		Tg	°C	CTE-z	ppm/°C	εr		Electric strenght	KV/mm	Surface resistivity	MΩ	Thermal conductive factor	W/m*K	Td260	min	Td288	min	Td value	°C	Peel strength	N/mm
Material for high frequency boards	Rogers 4350B HF material	Tg	280°	CTE-z	50	εr	3,5@10GHz	Electric strenght	31	Surface resistivity	5,7 x 10^9	Thermal conductive factor	0,69	Td260	-	Td288	-	Td value	390°	Peel strength	0,9
Material for high frequency boards	ISOLA IS620 E-fibre glas	Tg	220°	CTE-z	55	εr	4,5@1MHz	Electric strenght	37	Surface resistivity	7,3 x 10^6	Thermal conductive factor	-	Td260	-	Td288	-	Td value	-	Peel strength	1,2
Material for high frequency boards	Taconic RF-35 Ceramic	Tg	315°	CTE-z	64	εr	3,5@1,9GHz	Electric strenght	-	Surface resistivity	1,5 x 10^8	Thermal conductive factor	0,24	Td260	-	Td288	-	Td value	-	Peel strength	1,8
Material for high frequency boards	Taconic TLX PTFE	Tg	-	CTE-z	135	εr	2,5@10GHz	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductive factor	0,19	Td260	-	Td288	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Taconic TLC PTFE	Tg	-	CTE-z	70	εr	3,2@10GHz	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductive factor	0,24	Td260	-	Td288	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3001 Bonding Film for PTFE	Tg	160	CTE-z	-	εr	2,28	Electric strenght	98	Surface resistivity	1 x 10^9	Thermal conductive factor	0,22	Td260	-	Td288	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3003 PTFE ceramic-filled	Tg	-	CTE-z	25	εr	3,0@10GHz	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductive factor	0,50	Td260	-	Td288	-	Td value	500°	Peel strength	2,2
Material for high frequency boards	Rogers RO3006 PTFE ceramic-filled	Tg	-	CTE-z	24	εr	6,2@10GHz	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductive factor	0,79	Td260	-	Td288	-	Td value	500°	Peel strength	1,2
Material for high frequency boards	Rogers RO3010 PTFE ceramic-filled	Tg	-	CTE-z	16	εr	10@10GHz	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductive factor	0,95	Td260	-	Td288	-	Td value	500°	Peel strength	1,6
Material for high frequency boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	εr	4,2@1MHz	Electric strenght	57	Surface resistivity	1,6 x 10^9	Thermal conductive factor	0,20	Td260	60	Td288	60	Td value	387°	Peel strength	1,2

Material for high-Tg circuit boards (selection)

Material for High-Tg boards	Tg	CTE-z	εr	Electric strenght	Surface resistivity	CTI	Td260	Td288	Td value	Peel strength
Material for High-Tg boards		Tg	°C	CTE-z	ppm/°C	εr	@1GHz	Electric strenght	KV/mm	Surface resistivity	MΩ	CTI	PLC	Td260	min	Td288	min	Td value	°C	Peel strength	N/mm
Material for High-Tg boards	ISOLA IS410 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	εr	3,90	Electric strenght	50	Surface resistivity	8,0 x 10^6	CTI	PLC 3	Td260	50	Td288	10	Td value	350°	Peel strength	1,2
Material for High-Tg boards	ISOLA IS420 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	εr	4,17	Electric strenght	40	Surface resistivity	3,0 x 10^6	CTI	PLC 3	Td260	60	Td288	15	Td value	350°	Peel strength	1,3
Material for High-Tg boards	ISOLA G200 BT-Epoxy	Tg	180°	CTE-z	55	εr	3,70	Electric strenght	45	Surface resistivity	2,2 x 10^6	CTI	PLC 3	Td260	60	Td288	10	Td value	325°	Peel strength	1,0
Material for High-Tg boards	Shengyi S1000-2 FR4 HTg	Tg	180°	CTE-z	45	εr	4,80*	Electric strenght	63	Surface resistivity	7,9 x 10^7	CTI	PLC 3	Td260	60	Td288	20	Td value	345°	Peel strength	1,4
Material for High-Tg boards	ITEQ IT-180A FR4 HTg	Tg	175°	CTE-z	45	εr	4,40	Electric strenght	30	Surface resistivity	1 x 10^4	CTI	-	Td260	60	Td288	30	Td value	345°	Peel strength	1,0
Material for High-Tg boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	εr	-	Electric strenght	57	Surface resistivity	1,6 x 10^9	CTI	-	Td260	60	Td288	60	Td value	387°	Peel strength	1,2

*CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Additional information

Download data sheets (materials, solder-stop, marking prints, etc.)
Circuit board surfaces
Overview of technical options

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