Printed circuit board materials

Various requirements for printed circuit boards make the use of different circuit board substrates necessary.

Whereas for many standard applications the classical FR4 material is sufficient, possibly in high Tg version (for improved thermo-mechanical properties), for other areas (such as high frequencies) alternate materials are absolutely required.

The following information is intended as a abstract summary of all available material types and their fundamental properties, to make it easier for you to make a selection according to the required field of application.

The standard values of the processed materials can be found in following PDFs:

Material samples of the company Rogers can directly be requested here:
http://rogerscorp.force.com/samples/samples_public

On request, you can order circuit boards with EN45545-2: 2013 certified Isola material (fire protection requirements for rail vehicles): EN45545-2: 2013 Information.

Please note: The selected materials may be replaced by technically equivalent or similar products, according to available stocks on hand.

Materials for rigid circuit boards

Material for rigid PCBs	Tg	CTE-z	Ԑr	Electric strength	Surface resistivity	CTI	Dk Permittivity	Dk Loss Tangent	Td value	Peel strength
Material for rigid PCBs		Tg	°C	CTE-z	ppm/°C	Ԑr	@1GHz	Electric strength	KV/mm	Surface resistivity	MΩ	CTI	PLC	Dk Permittivity	min	Dk Loss Tangent	min	Td value	°C	Peel strength	N/mm
Material for rigid PCBs	ISOLA Duraver DE104 Standard FR4	Tg	135°	CTE-z	70	Ԑr	4,37	Electric strength	54	Surface resistivity	1,0 x 10^6	CTI	2	Dk Permittivity	4,37	Dk Loss Tangent	0,0220	Td value	315°	Peel strength	1,6
Material for rigid PCBs	ISOLA Duraver DE104 KF FR4 tracking resistant	Tg	135°	CTE-z	45	Ԑr	4,00	Electric strength	39	Surface resistivity	1,0 x 10^6	CTI	1	Dk Permittivity	4,6*	Dk Loss Tangent	0,0200*	Td value	315°	Peel strength	1,6
Material for rigid PCBs	ISOLA DE156 FR4 halogen-free	Tg	155°	CTE-z	45	Ԑr	4,0	Electric strength	36	Surface resistivity	4,0 x 10^6	CTI	-	Dk Permittivity	4,01	Dk Loss Tangent	0,0161	Td value	390°	Peel strength	1,4
Material for rigid PCBs	ISOLA IS410 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	Ԑr	3,97	Electric strength	44	Surface resistivity	8,0 x 10^6	CTI	3	Dk Permittivity	3,90	Dk Loss Tangent	0,0189	Td value	350°	Peel strength	1,2
Material for rigid PCBs	ISOLA IS420 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	Ԑr	4,04	Electric strength	54	Surface resistivity	3,0 x 10^6	CTI	3	Dk Permittivity	4,17	Dk Loss Tangent	0,0161	Td value	350°	Peel strength	1,3
Material for rigid PCBs	Shengyi S1141 FR4 Alternative	Tg	140°	CTE-z	65	Ԑr	4,60*	Electric strength	-	Surface resistivity	5,4 x 10^7	CTI	3	Dk Permittivity	-	Dk Loss Tangent	0,0150*	Td value	310°	Peel strength	1,8
Material for rigid PCBs	Shengyi S1000-2 FR4 HTg alternative	Tg	180°	CTE-z	45	Ԑr	4,80*	Electric strength	-	Surface resistivity	7,9 x 10^7	CTI	3	Dk Permittivity	-	Dk Loss Tangent	0,0130*	Td value	345°	Peel strength	1,4
Material for rigid PCBs	ITEQ IT-180A FR4 HTg alternative	Tg	175°	CTE-z	45	Ԑr	4,40	Electric strength	45	Surface resistivity	3,0 x 10^10	CTI	-	Dk Permittivity	4,40	Dk Loss Tangent	0,0150	Td value	345°	Peel strength	1,4

* at 1MHz

Unless otherwise noted, the CTI (Comparative Tracking Index) which indicates the tracking resistance, is PLC3 (175V - 250V) for rigid PCBs. On request, we are also able to produce PCBs with PLC 2 (> 250V), PLC 1 (> 400V) or PLC 0 (> 600V). See Overview of CTI / PLC.

Materials for flexible circuit boards

Material for flexible PCBs	Max. recommended operating temperature	Copper type	Glass transition temperature Tg	εr	CTE-z	Electric strenght	Surface resistivity	Peel strength
Material for flexible PCBs		Max. recommended operating temperature	°C	Copper type	*	Glass transition temperature Tg	°C	εr	@1MHz	CTE-z	ppm/°C	Electric strenght	KV/mm	Surface resistivity	MΩ	Peel strength	N/mm
Material for flexible PCBs	Polyimide + Adhesive	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	Shengyi SF305	Max. recommended operating temperature	105°	Copper type	RA	Glass transition temperature Tg	-	εr	3,6	CTE-z	-	Electric strenght	21	Surface resistivity	1 x 10^5	Peel strength	1,1
Material for flexible PCBs	Adhesiveless	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	DuPont Pyralux AP	Max. recommended operating temperature	180°	Copper type	RA	Glass transition temperature Tg	220	εr	3,4	CTE-z	25	Electric strenght	256	Surface resistivity	1 x 10^10	Peel strength	1,8
Material for flexible PCBs	Panasonic RF775	Max. recommended operating temperature	130°	Copper type	ED	Glass transition temperature Tg	343	εr	3,2	CTE-z	-	Electric strenght	276	Surface resistivity	1 x 10^8	Peel strength	1,7
Material for flexible PCBs	Thinflex W-05050	Max. recommended operating temperature	105°	Copper type	ED	Glass transition temperature Tg	350	εr	3,3	CTE-z	24	Electric strenght	216	Surface resistivity	1 x 10^5	Peel strength	0,6
Material for flexible PCBs	PI Coverlay	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	Shengyi SF305C	Max. recommended operating temperature	105°	Copper type	-	Glass transition temperature Tg	-	εr	-	CTE-z	-	Electric strenght	-	Surface resistivity	3 x 10^6	Peel strength	-
Material for flexible PCBs	DuPont Pyralux FR	Max. recommended operating temperature	180°	Copper type	-	Glass transition temperature Tg	-	εr	3,5	CTE-z	-	Electric strenght	138	Surface resistivity	1 x 10^7	Peel strength	-
Material for flexible PCBs	Adhesive tape	Max. recommended operating temperature		Copper type		Glass transition temperature Tg		εr		CTE-z		Electric strenght		Surface resistivity		Peel strength
Material for flexible PCBs	3M 9077	Max. recommended operating temperature	150°	Copper type	-	Glass transition temperature Tg	-	εr	-	CTE-z	-	Electric strenght	-	Surface resistivity	-	Peel strength	-

* RA = Rolled copper, suitable for dynamic, flexible applications; ED = Electrolytically deposited copper , only suited for stable and semi-dynamic applications

Materials for metal core boards

1 layer

Material for metal core boards 1 Layer	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 1 Layer		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 1 Layer	TC-Lam 2.0	Thermal conductivity	2.0	Thermal resistance	0.50	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	5.0	CTI	0
Material for metal core boards 1 Layer	HA50 (3)	Thermal conductivity	2.2	Thermal resistance	0.41	Surface resistivity	10^6	Dielectric glass transition	120	Dielectric Breakdown (AC)*	4.3	CTI	0
Material for metal core boards 1 Layer	AL-200	Thermal conductivity	2.0	Thermal resistance	0.35	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	AL-300	Thermal conductivity	3.0	Thermal resistance	0.30	Surface resistivity	10^8	Dielectric glass transition	-	Dielectric Breakdown (AC)*	3.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 1 Layer	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric

2 layers (plated-through)

Material for metal core boards 2 Layers (plated-through)	Thermal conductivity	Thermal resistance	Surface resistivity	Dielectric glass transition	Dielectric Breakdown (AC)*	CTI
Material for metal core boards 2 Layers (plated-through)		Thermal conductivity	W/mK	Thermal resistance	K/W	Surface resistivity	MΩ	Dielectric glass transition	°C	Dielectric Breakdown (AC)*	kV	CTI	PLC
Material for metal core boards 2 Layers (plated-through)	CCAF-05	Thermal conductivity	2.2	Thermal resistance	0.45	Surface resistivity	10^6	Dielectric glass transition	-	Dielectric Breakdown (AC)*	6.0	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4A2	Thermal conductivity	2.2	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	130	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B1 flexible	Thermal conductivity	1.0	Thermal resistance	-	Surface resistivity	10^7	Dielectric glass transition	100	Dielectric Breakdown (AC)*	7.5	CTI	0
Material for metal core boards 2 Layers (plated-through)	Ventek VT-4B3 limited flexible	Thermal conductivity	3.0	Thermal resistance	-	Surface resistivity	10^8	Dielectric glass transition	130	Dielectric Breakdown (AC)*	9.0	CTI	0

* Examples for 100μm dielectric or 80μm for CCAF material

Material for high frequency boards

Material for high frequency boards	Tg	CTE-z	Ԑr	Electric strenght	Surface resistivity	Thermal conductivity	Dk Loss Tangent	Td value	Peel strength
Material for high frequency boards		Tg	°C	CTE-z	ppm/°C	Ԑr	@10GHz	Electric strenght	KV/mm	Surface resistivity	MΩ	Thermal conductivity	W/m*K	Dk Loss Tangent	@10GHz	Td value	°C	Peel strength	N/mm
Material for high frequency boards	Rogers 4350B HF material	Tg	280°	CTE-z	32	Ԑr	3,48	Electric strenght	31	Surface resistivity	5,7 x 10^9	Thermal conductivity	0,69	Dk Loss Tangent	0,0037	Td value	390°	Peel strength	0,9
Material for high frequency boards	ISOLA IS620 E-fibre glas	Tg	220°	CTE-z	55	Ԑr	4,45*	Electric strenght	-	Surface resistivity	2,8 x 10^6	Thermal conductivity	-	Dk Loss Tangent	0,0080*	Td value	-	Peel strength	1,2
Material for high frequency boards	Taconic RF-35 Ceramic	Tg	315°	CTE-z	64	Ԑr	3,50**	Electric strenght	-	Surface resistivity	1,5 x 10^8	Thermal conductivity	0,24	Dk Loss Tangent	0,0018**	Td value	-	Peel strength	1,8
Material for high frequency boards	Taconic TLX PTFE	Tg	-	CTE-z	135	Ԑr	2,50	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,19	Dk Loss Tangent	0,0019	Td value	-	Peel strength	2,1
Material for high frequency boards	Taconic TLC PTFE	Tg	-	CTE-z	70	Ԑr	3,20	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,24	Dk Loss Tangent	-	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3001 Bonding Film for PTFE	Tg	160°	CTE-z	-	Ԑr	2,28	Electric strenght	98	Surface resistivity	1 x 10^9	Thermal conductivity	0,22	Dk Loss Tangent	0,0030	Td value	-	Peel strength	2,1
Material for high frequency boards	Rogers RO3003 PTFE ceramic-filled	Tg	-	CTE-z	25	Ԑr	3,00	Electric strenght	-	Surface resistivity	1 x 10^7	Thermal conductivity	0,50	Dk Loss Tangent	0,0013	Td value	500°	Peel strength	2,2
Material for high frequency boards	Rogers RO3006 PTFE ceramic-filled	Tg	-	CTE-z	24	Ԑr	6,15	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,79	Dk Loss Tangent	0,0020	Td value	500°	Peel strength	1,2
Material for high frequency boards	Rogers RO3010 PTFE ceramic-filled	Tg	-	CTE-z	16	Ԑr	10,20	Electric strenght	-	Surface resistivity	1 x 10^5	Thermal conductivity	0,95	Dk Loss Tangent	0,0022	Td value	500°	Peel strength	1,6
Material for high frequency boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	Ԑr	4,20*	Electric strenght	57	Surface resistivity	1,6 x 10^9	Thermal conductivity	0,20	Dk Loss Tangent	0,0100*	Td value	387°	Peel strength	1,2

* at 1MHz ** at 1,9GHz

Material for high-Tg circuit boards (selection)

Material for High-Tg boards	Tg	CTE-z	Ԑr	Electric strenght	Surface resistivity	CTI	Thermal conductivity	Td value	Peel strength
Material for High-Tg boards		Tg	°C	CTE-z	ppm/°C	Ԑr	@1GHz	Electric strenght	KV/mm	Surface resistivity	MΩ	CTI	PLC	Thermal conductivity	W/m*K	Td value	°C	Peel strength	N/mm
Material for High-Tg boards	ISOLA IS410 HTg, CAF-Enhanced	Tg	180°	CTE-z	55	Ԑr	3,97	Electric strenght	44	Surface resistivity	8,0 x 10^6	CTI	3	Thermal conductivity	0,50	Td value	315°	Peel strength	1,6
Material for High-Tg boards	ISOLA IS420 HTg, CAF-Enhanced	Tg	170°	CTE-z	45	Ԑr	4,04	Electric strenght	54	Surface resistivity	3,0 x 10^6	CTI	3	Thermal conductivity	0,40	Td value	350°	Peel strength	1,3
Material for High-Tg boards	Shengyi S1000-2 FR4 HTg alternative	Tg	180°	CTE-z	45	Ԑr	4,80*	Electric strenght	-	Surface resistivity	7,9 x 10^7	CTI	3	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	ITEQ IT-180A FR4 HTg alternative	Tg	175°	CTE-z	45	Ԑr	4,40	Electric strenght	45	Surface resistivity	3,0 x 10^10	CTI	-	Thermal conductivity	-	Td value	345°	Peel strength	1,4
Material for High-Tg boards	ARLON 85N Polyimide HTg	Tg	250°	CTE-z	55	Ԑr	4,20*	Electric strenght	57	Surface resistivity	1,6 x 10^9	CTI	-	Thermal conductivity	0,20	Td value	387°	Peel strength	1,2

* at 1MHz

CAF - Conductive Anodic Filament: an undesirable conducting filament in the substrate of a circuit board

Additional information

Download data sheets (materials, solder-stop, marking prints, etc.)
Circuit board surfaces
Overview of technical options

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Printed circuit board materials

Materials for rigid circuit boards

Materials for flexible circuit boards

Materials for metal core boards

1 layer

2 layers (plated-through)

Material for high frequency boards

Material for high-Tg circuit boards (selection)

Additional information

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